Breaking the AI Memory Wall through Novel Semiconductor Fabrication

Hear the CEO behind a breakthrough chip technology explain how new semiconductor packaging is solving AI's biggest computing bottleneck.

Dr Jekaterina Viktorova, CEO of Syenta, will walk through the specific technical problem constraining AI performance right now: how data moves between chips. Her company has developed a novel packaging approach to solve this bottleneck, and she'll explain what makes it different from existing solutions and why it matters for scaling AI systems. If you're building or investing in AI infrastructure, or curious how Australian deep-tech is tackling a foundational computing challenge, this fireside chat cuts through the hype to the actual engineering.